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Rambus Completes Acquisition of Hardent

Strengthens CXL Memory Interconnect Initiative and accelerates roadmap of data center solutions

Rambus to Acquire Hardent, Accelerating Roadmap for Next-Generation Data Center Solutions

Augments world-class engineering team with deep SoC digital design expertise for Rambus CXL Memory Interconnect Initiative

Frame Buffer Compression IP Subsystem for TCON IC Manufacturers Launched by Hardent

Proven IP subsystem enables TCON IC manufacturers to leverage new Embedded DisplayPort low power features and significantly reduce frame buffer area using VESA DSC.

Alain Legault

Vice President IP Products

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HardentMontreal

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