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Blog

News
May 25, 2021

Hardent Joins Samsung SAFE™ IP Partner Program & Launches New Display IP Subsystem Solution in Collaboration with Rambus

New Rambus MIPI® DSI-2℠ / Hardent VESA® DSC host IP subsystem supports Samsung Foundry customers designing next-generation display products. …
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March 31, 2020

Hardent Joins Forces with Maojet & Fujisoft To Expand Presence in Asia

We recently appointed Maojet Technology Corporation as our new IP representative for Taiwan, and Fujisoft as our new IP representative for Japan. We will be working closely with both companies to develop our IP business within these two key markets. …
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December 6, 2018

FPGA Design Analysis Using the Vivado Design Suite

Useful commands for FPGA design analysis in the Vivado Design Suite that will help you save time and meet your performance goals! …
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March 14, 2018

New SystemVerilog Online Training Course

Hardent’s new SystemVerilog for Verification online training course gives you the flexibility to learn SystemVerilog at your own pace. You'll learn through practical lab exercises based on real scenarios, and even get a certificate! …
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2017

December 1, 2017

CES 2018: The Latest In VESA DSC Video Compression Technology

September 28, 2017

Using Reed-Solomon Forward Error Correction (FEC) Code For Display Interfaces

August 28, 2017

New Zynq UltraScale+ MPSoC Training Course

July 19, 2017

How To Use The OpenAMP Framework For Heterogeneous Devices, Part 2

July 13, 2017

How To Use The OpenAMP Framework For Heterogeneous Devices, Part 1

April 10, 2017

New Webinar Schedule: Constraint Management, SystemVerilog, and OpenAMP

January 24, 2017

Tutorial: Developing Embedded Linux Systems With Yocto For Zynq UltraScale+ MPSoCs

2016

September 22, 2016

Montreal ARM / KEIL User Group Meeting: Securing Embedded and IoT Devices with ARM TrustZone Technology for the v8-M Architecture

August 10, 2016

MIPI DevCon 2016: Learn How To Use VESA Display Stream Compression To Create Higher Resolution Displays

April 15, 2016

ARM DS-5 Debugging & CMSIS Software Packs at the Toronto ARM/KEIL User Group

April 6, 2016

How to Use Xilinx PetaLinux Tools to Deploy Xen Hypervisor & Linux on the Zynq UltraScale+ MPSoC

March 31, 2016

An Introduction to the Zynq UltraScale+ MPSoC

February 11, 2016

Overcoming Functional Verification Challenges by Automating Register Design and Documentation

2015

July 9, 2015

Learn About the Latest ARM Technology and ARM / KEIL Tools at the Toronto User Group Meeting

April 9, 2015

A Quick Guide to VESA Display Stream Compression

February 11, 2015

Online Embedded Systems Training with PetaLinux ZYBO BSP Available To Download

January 21, 2015

Visually lossless video compression technology: unveiling the latest solution at CES 2015

Latest News
Contact Us
Rambus Completes Acquisition of Hardent
Strengthens CXL Memory Interconnect Initiative and accelerates roadmap of data center solutions
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Rambus to Acquire Hardent, Accelerating Roadmap for Next-Generation Data Center Solutions
Augments world-class engineering team with deep SoC digital design expertise for Rambus CXL Memory Interconnect Initiative
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Frame Buffer Compression IP Subsystem for TCON IC Manufacturers Launched by Hardent
Proven IP subsystem enables TCON IC manufacturers to leverage new Embedded DisplayPort low power features and significantly reduce frame buffer area using VESA DSC.
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Alain Legault
Vice President IP Products
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Time to market was one of our first considerations in choosing Hardent to design a PCI communication bridge. They grasped the project requirements in a matter of days. Their impressive expertise and responsiveness made the development process very smooth, as if they were working right down the hall.

Nicolas Gonthier
Hardware Design Manager
Verint Systems Canada Inc.
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