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Panel Discussion | Design & Reuse IP SoC Day, Silicon Valley 2021

Date: April 6, 2021

Time: 13:00 PT

Panel Discussion: The Expanding Universe of MIPI Applications: New Use Cases Drive Higher Display Performance

Find out more about this event and register to save your spot here.

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Rambus Completes Acquisition of Hardent
Strengthens CXL Memory Interconnect Initiative and accelerates roadmap of data center solutions
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Rambus to Acquire Hardent, Accelerating Roadmap for Next-Generation Data Center Solutions
Augments world-class engineering team with deep SoC digital design expertise for Rambus CXL Memory Interconnect Initiative
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Frame Buffer Compression IP Subsystem for TCON IC Manufacturers Launched by Hardent
Proven IP subsystem enables TCON IC manufacturers to leverage new Embedded DisplayPort low power features and significantly reduce frame buffer area using VESA DSC.
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We made the decision to work with Hardent as we felt confident that their strategic approach to the development process, combined with their technical expertise and training credentials, would help us to successfully reach our end goal and equip our in-house team with the electronic design knowledge to complete not just this project but other projects in the future.

Stefan Grigoras
Operations Manager
NDT Technologies Inc.
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